09.09.15
AIXTRON SE has sold the first Optacap-200 encapsulation tool to a major Asian display manufacturer. The standalone R&D system that handles substrate sizes of 200 mm x 200 mm was ordered in the third quarter 2015 and is scheduled for delivery in the first quarter 2016.
The Optacap plasma enhanced chemical vapor deposition (PECVD) technology enables the deposition of highly flexible and effective barrier films for thin-film encapsulation of OLED display, OLED lighting, organic photovoltaic and flexible electronic devices.
The Optacap encapsulation technology has been the main driver for AIXTRON’s acquisition of Silicon Valley-based PlasmaSi, Inc.
The Optacap plasma enhanced chemical vapor deposition (PECVD) technology enables the deposition of highly flexible and effective barrier films for thin-film encapsulation of OLED display, OLED lighting, organic photovoltaic and flexible electronic devices.
The Optacap encapsulation technology has been the main driver for AIXTRON’s acquisition of Silicon Valley-based PlasmaSi, Inc.