10.23.15
Thinfilm Electronics, Inc. (Thinfilm), the US subsidiary of Thin Film Electronics, will receive $350,000 in funding through the FlexTech Alliance to create smart labels featuring next-generation sensors and near field communications (NFC) capabilities.
Through the project, Thinfilm plans to extend the scope of its proprietary technology and smart label platform, while maintaining alignment with established processes for high-volume label manufacturing.
“FlexTech is excited about the advancements this important project will bring about in smart labels and their dynamic sensing functionality,” said Michael Ciesinski, FlexTech Alliance president and CEO.
The thin, flexible smart labels produced by Thinfilm as a result of this project will incorporate one or more sensors that dynamically detect, measure and report on a range of environmental phenomena.
“Our project with FlexTech is a significant step in creating the foundation for a next-generation sensor label capable of supporting a number of critical applications,” said Erwan Le Roy, SVP and GM, Smart Sensors, for Thinfilm.
Through the project, Thinfilm plans to extend the scope of its proprietary technology and smart label platform, while maintaining alignment with established processes for high-volume label manufacturing.
“FlexTech is excited about the advancements this important project will bring about in smart labels and their dynamic sensing functionality,” said Michael Ciesinski, FlexTech Alliance president and CEO.
The thin, flexible smart labels produced by Thinfilm as a result of this project will incorporate one or more sensors that dynamically detect, measure and report on a range of environmental phenomena.
“Our project with FlexTech is a significant step in creating the foundation for a next-generation sensor label capable of supporting a number of critical applications,” said Erwan Le Roy, SVP and GM, Smart Sensors, for Thinfilm.