03.22.16
At OFC 2016, imec presents performance improvements of various key building blocks of its wafer-scale integrated silicon photonics platform (iSiPP).
The new results expand imec’s iSiPP device portfolio to support 50Gb/s non-return-to-zero (NRZ) lane rates, and are an important milestone for the realization of high data rate silicon integrated optical interconnects targeting high density, high bandwidth, low power telecom and datacom transceivers, as well as for low cost large volume applications such as sensors or LiDAR.
Through process and design optimizations, imec has improved the operating speed of the silicon-based traveling-wave mach-zehnder modulators and ring modulators to reach 50Gb/s NRZ lane rates.
Imec also provides technology customization options with dedicated wafer fabrication services supported by a Process Design Kit (PDK). This service enables the use of full-size reticles, delivery of full wafers, and access to specialty modules enabling high efficiency integrated heaters, MOSCAP devices and flip-chip assembly amongst others.
The new results expand imec’s iSiPP device portfolio to support 50Gb/s non-return-to-zero (NRZ) lane rates, and are an important milestone for the realization of high data rate silicon integrated optical interconnects targeting high density, high bandwidth, low power telecom and datacom transceivers, as well as for low cost large volume applications such as sensors or LiDAR.
Through process and design optimizations, imec has improved the operating speed of the silicon-based traveling-wave mach-zehnder modulators and ring modulators to reach 50Gb/s NRZ lane rates.
Imec also provides technology customization options with dedicated wafer fabrication services supported by a Process Design Kit (PDK). This service enables the use of full-size reticles, delivery of full wafers, and access to specialty modules enabling high efficiency integrated heaters, MOSCAP devices and flip-chip assembly amongst others.