The latest trends and opportunities in flexible hybrid electronics (FHE) take the spotlight at FLEX Taiwan 2019 as industry experts and leaders gather to provide insights into flexible chips and batteries, Smart clothing, e-wear, precision sports and other flexible electronics innovations. FLEX Taiwan 2019 (May 29-30 at the Taipei International Convention Center) also highlights the latest advances in flexible electronics manufacturing technology.
Organized by SEMI-FlexTech, a SEMI Strategic Association Partner, FLEX Taiwan 2019 will feature presentations by the industry thought leaders (see below) on opening day.
The global flexible electronics market is expected to be a major growth driver for the microelectronics industry. Powering this rapid expansion are key application areas including wearables, robotics, telematics and industrial automation. Flexible electronics are inspiring innovative solutions across agriculture, the environment, healthcare, transportation and other key areas to advance social good by combining high-performance semiconductor components with the lightness, scalability, softness and flexibility typical of printed electronics.
“Taiwan is a leader in the global microelectronics industry with cutting-edge manufacturing technologies and the densest semiconductor device supply chain community in the world,” said Terry Tsao, global chief marketing officer and president of SEMI Taiwan. “With its premier semiconductor and display manufacturing technologies, Taiwan is in a strong position to drive FHE innovation. SEMI-FlexTech complements Taiwan’s technology prowess, providing a key platform for promoting FHE collaboration and technology development across the industry to help drive growth.”
Flexible Hybrid Electronics Applications
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Satoshi Maeda, Senior Coordinator – Development and International Standardization of Garment Type Wearable Devices |
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Reinhold H. Dauskardt, Professor – Human Skin: the “Seam” between Our Body and e-Wear Technologies |
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Gillian Ewers, VP Marketing – Roadmap to Trillions of Smart Objects |
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Flexible Hybrid Electronics Manufacturing
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Dr. Vincent Lin, Director, Corporate R&D/Technology Development – New Generation RF & Si-Photonic Packaging Technologies |
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Stan Yang, Regional Sales, Head-China & Taiwan Flexible Technology Group – Flexible Manufacturing Technologies |
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For the full agenda, click here.