08.09.22
The STEVAL-ASTRA1B multi-connectivity evaluation platform from STMicroelectronics provides a complete ecosystem for building complete proof-of-concept for asset tracking systems. Battery-powered, and with a small form factor, the evaluation kit also includes firmware to simplify development targeted applications such as livestock monitoring, fleet management, and logistics.
The kit helps users evaluate ST’s industry-first short- and long-range STM32 wireless System-on-Chip (SoC) devices. The STM32WL55JC sub-GHz SoC for long-range connectivity (LPWAN) implements the LoRaWAN protocol and provides LoRa, (G)FSK, (G)MSK, and BPSK modulations. The other wireless SoC is the STM32WB5MMG module for 2.4GHz Bluetooth Low Energy and Zigbee connectivity. Each device has an Arm Cortex-M4 core for application processing with a dedicated Cortex-M0+ to manage the radio.
The development kit also includes an ST25DV64K near-field communication (NFC) contactless chip for secure pairing and communication and an STSAFE-A110 secure element that ensures privacy and guards against hacking. In addition, a Teseo-LIV3F miniature GNSS module provides accurate and reliable outdoor positioning.
Numerous ST sensors are integrated for monitoring asset condition and environment. These include an STTS22H low-voltage, ultra-low-power temperature sensor with ±0.5°C accuracy, HTS221 digital humidity and temperature sensor; LPS22HH barometric pressure sensor, and LIS2DTW12 ultra-low-power 3-axis accelerometer. There is also an LSM6DSO32X always-on inertial module, which contains a3D accelerometer and 3D gyroscope with machine-learning core.
The kit helps users evaluate ST’s industry-first short- and long-range STM32 wireless System-on-Chip (SoC) devices. The STM32WL55JC sub-GHz SoC for long-range connectivity (LPWAN) implements the LoRaWAN protocol and provides LoRa, (G)FSK, (G)MSK, and BPSK modulations. The other wireless SoC is the STM32WB5MMG module for 2.4GHz Bluetooth Low Energy and Zigbee connectivity. Each device has an Arm Cortex-M4 core for application processing with a dedicated Cortex-M0+ to manage the radio.
The development kit also includes an ST25DV64K near-field communication (NFC) contactless chip for secure pairing and communication and an STSAFE-A110 secure element that ensures privacy and guards against hacking. In addition, a Teseo-LIV3F miniature GNSS module provides accurate and reliable outdoor positioning.
Numerous ST sensors are integrated for monitoring asset condition and environment. These include an STTS22H low-voltage, ultra-low-power temperature sensor with ±0.5°C accuracy, HTS221 digital humidity and temperature sensor; LPS22HH barometric pressure sensor, and LIS2DTW12 ultra-low-power 3-axis accelerometer. There is also an LSM6DSO32X always-on inertial module, which contains a3D accelerometer and 3D gyroscope with machine-learning core.