03.20.24
At drupa, the world’s leading trade fair for print and cross-media solutions, the OE-A will inform international visitors and attendees about the broad range of application possibilities of printed electronics technology. The focus will especially lie on smart packaging and technologies + applications.
The OE-A booth will be located at Hall 14, D63, next to the VDMA Touchpoint Sustainability. Get to know the OE-A and the printed electronics industry by visiting our booth.
The OE-A will host seminars on printed electronics at the drupa cube in Hall 6, D03. The drupa cube is the conference venue at the show where global trends and dynamics (in print and beyond) are discussed and debated with a full agenda of sessions every day during drupa. OE-A members will be there to present and discuss latest developments in the field of printed electronics in two sessions:
• May 29, 2024: Printed Electronics Solutions for Sustainable Smart Packaging, 3-5 pm
Preliminary Agenda
– 15:00: Welcome & Introduction – Dr. Klaus Hecker, managing director, OE-A
– 15:10: Compostable printable RFID antennas for sustainable smart packaging –Ofer Shochet, co-founder and CEO, Copprint
– 15:30: Pad Printing Electronics: Rethinking printed antennas for future connectivity – Beate Grobben, head of business development EIMEA, Printed Electronics, Henkel Adhesive Technologies, and Dominik Aeschbach, area sales manager, Teca-Print
– 15:50: Progress towards manufacturing of paper-based printed circuit boards – Gerhard Domann, head of application technology, head of optics and electronics, Fraunhofer ISC
– 16:10: Low-cost sensing devices for IoT applications – Ashok Sridhar, CEO, TracXon
– 16:30: Roundtable discussion: Printed Electronics for Sustainable Smart Packaging
– 16:50: Summary & Adjourn – Dr. Klaus Hecker
• June 4, 2024: Printed Electronics: Technologies and Applications, 3-5 pm
Preliminary Agenda
– 15:00: Welcome & Introduction – Dr. Klaus Hecker, managing director, OE-A
– 15:10: Printing, Converting, Assembling – co-creation along the full process chain – Dominik Reukauf, technical business development manager, Lohmann GmbH & Co. KG
– 15:30: Upscaling OPV into production tech – What are the obstacles to reach a competitive OPV industry in Europe – Thomas Kolbusch, director sales, marketing, technology, VP, COATEMA Coating Machinery GmbH
– 15:50: Next level functional printing for the electronics and hydrogen markets – Dr. Andreas Willert, deputy head of printed functionalities, chair of IEC TC 119, Fraunhofer ENAS
– 16:10: Full R2R Process Flow for Flexible and Hybrid Electronics – Dr. Tuomas Happonen, senior scientist, D. Sc. (Tech), printed electronics processing, VTT-Technical Research Centre of Finland Ltd.
– 16:30: How ePaper is shaping the future of smart packaging? – Hui Lee, president of E Ink Netherlands offices, E-Ink
– 16:50: Summary & Adjourn – Dr. Klaus Hecker
In addition, the OE-A is currently organizing a company visit at Coatema in the evening of June 4. Stay tuned for details.
For more information, please contact [email protected].
The OE-A booth will be located at Hall 14, D63, next to the VDMA Touchpoint Sustainability. Get to know the OE-A and the printed electronics industry by visiting our booth.
The OE-A will host seminars on printed electronics at the drupa cube in Hall 6, D03. The drupa cube is the conference venue at the show where global trends and dynamics (in print and beyond) are discussed and debated with a full agenda of sessions every day during drupa. OE-A members will be there to present and discuss latest developments in the field of printed electronics in two sessions:
• May 29, 2024: Printed Electronics Solutions for Sustainable Smart Packaging, 3-5 pm
Preliminary Agenda
– 15:00: Welcome & Introduction – Dr. Klaus Hecker, managing director, OE-A
– 15:10: Compostable printable RFID antennas for sustainable smart packaging –Ofer Shochet, co-founder and CEO, Copprint
– 15:30: Pad Printing Electronics: Rethinking printed antennas for future connectivity – Beate Grobben, head of business development EIMEA, Printed Electronics, Henkel Adhesive Technologies, and Dominik Aeschbach, area sales manager, Teca-Print
– 15:50: Progress towards manufacturing of paper-based printed circuit boards – Gerhard Domann, head of application technology, head of optics and electronics, Fraunhofer ISC
– 16:10: Low-cost sensing devices for IoT applications – Ashok Sridhar, CEO, TracXon
– 16:30: Roundtable discussion: Printed Electronics for Sustainable Smart Packaging
– 16:50: Summary & Adjourn – Dr. Klaus Hecker
• June 4, 2024: Printed Electronics: Technologies and Applications, 3-5 pm
Preliminary Agenda
– 15:00: Welcome & Introduction – Dr. Klaus Hecker, managing director, OE-A
– 15:10: Printing, Converting, Assembling – co-creation along the full process chain – Dominik Reukauf, technical business development manager, Lohmann GmbH & Co. KG
– 15:30: Upscaling OPV into production tech – What are the obstacles to reach a competitive OPV industry in Europe – Thomas Kolbusch, director sales, marketing, technology, VP, COATEMA Coating Machinery GmbH
– 15:50: Next level functional printing for the electronics and hydrogen markets – Dr. Andreas Willert, deputy head of printed functionalities, chair of IEC TC 119, Fraunhofer ENAS
– 16:10: Full R2R Process Flow for Flexible and Hybrid Electronics – Dr. Tuomas Happonen, senior scientist, D. Sc. (Tech), printed electronics processing, VTT-Technical Research Centre of Finland Ltd.
– 16:30: How ePaper is shaping the future of smart packaging? – Hui Lee, president of E Ink Netherlands offices, E-Ink
– 16:50: Summary & Adjourn – Dr. Klaus Hecker
In addition, the OE-A is currently organizing a company visit at Coatema in the evening of June 4. Stay tuned for details.
For more information, please contact [email protected].